Dual–Drive of Copper and Optical Connectivity Empowers AI Computing Power– Luxshare-Tech Presents Comprehensive Interconnect System

Mr. Tengfang Xiong, CEO of Luxshare-Tech, delivered the opening speech at the SuperNode Interconnect Technology Innovation Conference: "As large models surpass trillion-parameter thresholds and AI agents become practical, computing power demands are surging exponentially. Computing architectures are transitioning from traditional data centers to AI Data Centers (AIDCs). At this pivotal juncture of the AI revolution, we must proactively reconstruct digital infrastructure. Luxshare-Tech has therefore formulated and actively implemented its ‘Dual-Drive Strategy’ of copper and optical interconnects. Through synergistic design of copper and optical interconnects, we have developed 224G/448G integrated interconnect solutions. Copper cables reduce costs for short distances, while optical communication expands capacity for long distances, establishing a comprehensive, multi-dimensional interconnect system covering all scenarios."

On October 31, the 2025 SuperNode Interconnect Technology Innovation Conference concluded successfully in Songshan Lake, Dongguan. As a co-organizer, Luxshare-Tech showcased major achievements including its new AI full-rack interconnect solution and CPC solution test platform. Through live demonstrations and multiple technical presentations, the company provided in-depth insights into the evolution of high-speed interconnect technologies, shared its “dual-track optical-copper” strategy and implementation, and demonstrated its full-stack innovation capabilities to empower AI data center upgrades.

Optical-Copper Synergy: Full-Stack Solutions Unleash AI Computing Power

At its conference booth, Luxshare-Tech showcased its latest AI rack-level infrastructure solution. This integrated approach combines key technologies and products—including CPC, CPO, and Cable Cartridge—to form a three-pronged support system encompassing “high-speed interconnects, power supply, and thermal management.”

High-Speed Interconnects

• KOOLIO’s 112G/224G CPC solution reduces signal loss by over one-third compared to traditional PCB routing.

• Cable Cartridge achieves 10U 1024-pair density design, complemented by external copper cabling to support diverse scenarios from intra-rack short-distance to inter-rack interconnects.

• CPO solutions shorten electrical signal paths to reduce losses by over 40%. Combined with liquid cooling (non-conductive coolant), thermal energy consumption drops by nearly 90%, helping lower PUE to 1.1. 1RU height supports 64 800G ports (e.g., 51.2T switches), doubling bandwidth density while maintaining compatibility with flexible 400G/800G configurations.

  
  

Power Supply

• Including 48V PwrLink electrical interconnects, 10kW-class DC-DC converters, and PSUs—maintain compatibility with current 48V/12V ecosystems while supporting future 800V high-voltage power distribution through modular design. This resolves the transition challenge between surging power demands and power supply upgrades in AI data centers.

  
  

Thermal Management

• The integrated system of liquid cooling plates + manifolds + 120kW CDU establishes an end-to-end cooling network from cold plates to external refrigeration, meeting the thermal demands of high-density AI cabinets.

Pursuing Excellence— CPC Full-Path Test Platform Demonstrates Technical Prowess

At the conference, Luxshare-Tech's CPC solution test platform drew significant attention. By simulating high-load scenarios in AI data centers, it vividly demonstrated the exceptional end-to-end signal integrity and reliability of the 112G/224G CPC solutions, comprehensively showcasing Luxshare-Tech's expertise in AI data center interconnect technology.

Notably, this testing platform was jointly developed by Luxshare-Tech and switch chip manufacturers, marking a leap in the company's testing capabilities from purely measuring physical layer signal levels to in-depth network layer end-to-end testing. This breakthrough stems from Luxshare-Tech’s strategic commitment to deepening scenario understanding and building technology iteration paths for customers. It further demonstrates the company's robust system integration capabilities through cross-departmental collaboration, providing a highly valuable technical model for industry development.

In-Depth Insights— Multiple Presentations Unraveling Technical Evolution Logic

During the main forum and breakout sessions, Luxshare-Tech's expert team delivered multiple thematic presentations addressing interconnect technology challenges and solutions, offering numerous industry insights.

1. "Long-Term Evolution of CPC: Breaking Through with 448G High-Speed Copper Interconnect Solutions"

Chengwei Li, Senior System Architect at Luxshare-Tech mentioned: "Cost-effectiveness, network reliability, transmission speed, and deployment flexibility are the core bottlenecks in the development of current AI infrastructure. Luxshare-Tech's CPC solution addresses these challenges with low transmission loss, ultra-high density, high scalability, and modular design. The current solution can scale up to 448G, enabling single-channel 3.2Tbps and 6.4Tbps copper interconnects to support high-end computing scenarios. Moving forward, Luxshare-Tech will continue driving technical standardization through open platforms like ODCC and OCP, collaborating with manufacturers to accelerate ecosystem adoption."

2. “224G & 448G Bare Wire Simulation Design and Reliability Validation”

Huanzhong Yan, Senior Product Engineer at Luxshare-Tech talked about: "As data transmission speeds advance toward 224Gbps/448Gbps, purely experience-driven physical trial-and-error approaches struggle to address nanoscale dielectric control. Luxshare-Tech’s simulation design and reliability validation analysis of Optamax 224G/448G bare wires demonstrate that their electrical performance meets high-speed interconnect transmission requirements. After rigorous environmental and bend testing, they exhibit excellent reliability and temperature stability, making them suitable for next-generation high-speed interconnect systems."

3. Half-DSP-Based 800G LRO Optical Module Solution and Design

Xiaosong Ouyang, Optical Product Manager at Luxshare-Tech spoke about how distributed training for large AI models often requires “tens of thousands of GPU clusters,” making the power consumption and thermal management issues of traditional optical modules (with full DSP chips) increasingly prominent. This is becoming an “invisible bottleneck” constraining computing power release. Addressing the demand for low-power, low-cost 800G optical interconnects, Luxshare-Tech’s Half-DSP architecture 800G LRO optical module achieves a better balance between power consumption (below 10W), cost (reduced by approximately 15%), and performance (BER level exceeding 1E-10).

At the 2025 SuperNode Interconnect Technology Innovation Conference, Luxshare-Tech centered its presentation around its “Dual-Drive Copper-Optical” strategy. Through AI full-rack solutions, a CPC end-to-end testing platform, and four technical presentations, the company not only showcased breakthroughs in high-speed copper interconnect technology from 224G to 448G but also demonstrated its ecosystem development from individual components to comprehensive full-scenario solutions.

As a global leader in data center core component solutions, Luxshare-Tech remains focused on customer needs, tackling industry key challenges through R&D innovation. Moving forward, the company will deepen its commitment to the intelligent computing center sector, driving the standardization and industrialization of interconnect technologies. This will provide robust support for global computing infrastructure upgrades, continuously empowering the iterative development of AI data centers through the synergistic power of optical and copper technologies.