
Solutions
Unlock the full potential of your data center with a suite of solutions built to fit your needs today, and fuel continued growth in the future. Whether it’s AI Rack to stand up capacity fast, Between Rack to simplify cabinet-to-cabinet connectivity, or Liquid Cooling to raise density and efficiency—our data connectivity solutions can be deployed individually or together to accelerate growth. We partner with your team to align on goals, map technology to your space and performance specifications,
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Your Shortcut to AI-Ready Infrastructure
Scale AI capacity at the pace of innovation. Our AI Rack solution aligns cables, connectors, optics, thermal management, and power distribution into a single, pre-validated configuration. The result? Design reviews move faster and deployment becomes routine. Stand up compute faster, increase rack density, and protect up time as demand rises, without adding operational complexity.
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Simplify Inter-Cabinet Connectivity at Scale
Our Between Rack portfolio delivers comprehensive cabinet-to-cabinet connectivity with high-speed external interconnect solutions, including ACC, AEC, DAC, and AOC—all engineered to standardize links across both copper and optical domains. Supporting Ethernet, InfiniBand, PCIe, and CXL protocols, our solutions span OSFP, QSFP, and QSFP-DD form factors and scale reliably to speeds up to 1.6T. Deploy passive DACs for efficient short runs, select “Light Active” ACC/AEC for extendable copper reaches with low power and easy installs, or opt for advanced silicon photonics-based optics to satisfy a range of VRx/SRx/DRx/FRx specifications and longer-reach AOC for higher-density builds. Each interoperable product enables clean layouts, serviceable installation, and consistent, scalable performance — making expansion routine and future upgrades predictable.
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Build Capacity, Not Complexity
Power AI and HPC growth with a modular Liquid Cooling stack that brings together cold plates for direct-to-chip heat removal, immersion tanks for ultra-dense compute, CDUs (air-to-liquid and liquid-to-liquid) for high-efficiency heat exchange, manifolds for precise distribution, and BMQC blind-mate quick-connects for tool-less, serviceable installs.
The result is direct, uniform heat transfer and tighter thermal control than air cooling alone, helping you raise rack density while lowering energy use and operating noise. Built to integrate cleanly with existing infrastructure and facility loops, our Liquid Cooling portfolio supports faster deployment and predictable operations, with integrated controls for real-time monitoring and alarms to keep systems stable under sustained AI/HPC loads.
As power per rack climbs and refresh cycles accelerate, this architecture lets you scale capacity with confidence, delivering consistent performance today, and a clear path to higher densities tomorrow.
Contact Us
Ready to Get Started? We’re Here to Help.
Want to learn more about how we can work with you on your next project? Our global engineering and sales teams are here to answer questions, explore ideas, and help you find the right solution for your data center needs.

News & Resources
Browse our library of articles and technical resources to see how our products and solutions are solving real-world challenges, today. Discover insights and innovations that can move your AI, cloud, and hyperscale projects forward.
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NewsLuxshare-Tech Showcases 448G and 224G Solutions Powering Next-Gen AI Infrastructure at OCP Global Summit 2025CTA Loem Ipsum >
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NewsLuxshare-Tech’s New PCIe 6.0 CEM Connector “Redefines” the High-Speed Interconnect Standard with Outstanding SI PerformanceCTA Loem Ipsum >
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NewsLuxshare-Tech's 10U Air-to-Liquid CDU Solution For Data Center Liquid Cooling UpgradesCTA Loem Ipsum >