​Luxshare-Tech’s Full-Stack Computing Interconnect Solution Empowers a New AI Supercomputing Ecosystem

From June 22 to 26, the 4th China International Supply Chain Expo was held at the China International Exhibition Center in Beijing. Luxshare-Tech showcased its latest advancements in the Digital Technology Chain, focusing on AI computing infrastructure development. Luxshare-Tech highlighted its 448G CPC ultra-high-speed interconnect core technology, full-stack computing hardware product portfolio, and our integrated rack-level solution —three major core achievements. From foundational core technologies and hardware products to end-to-end solution enablement, Luxshare-Tech comprehensively demonstrated its innovation capabilities and implementation strengths in the fields of high-speed interconnect, high-efficiency thermal management and power supply, and computing power system integration.

I. Core Technology Breakthrough: Ultra-High-Speed Interconnect Technology Breaks Down Computing Power Transmission Barriers

448G CPC Ultra-High-Speed Interconnect Achieves Dual Leaps in High Bandwidth and Low Power Consumption

At this year’s Expo, Luxshare-Tech presented a live demo of its 448G CPC ultra-high-speed interconnect. Through a dynamic, real-time demonstration, the company vividly showcased its industry-leading ultra-high-speed copper interconnect core technology, making it one of the event’s standout technological highlights.

Leveraging its proprietary 448G CPC PCIe DAC high-speed interconnect technology, which achieves a single-port transmission rate of up to 448G, this solution doubles the bandwidth compared to mainstream industry solutions such as 112G and 224G. At the same time, it reduces overall system power consumption by over 30%, effectively addressing long-standing industry pain points in high-speed data transmission for high-end AI computing clusters, such as insufficient bandwidth, excessive power consumption, and excessive signal loss.

II. Full-Stack Product Matrix: Multi-Point Collaborative Deployment to Strengthen the Computing Hardware Foundation

XPO High-Speed Node Solution: Optimizing Network Architecture to Enhance Transmission Stability

In its hardware product showcase, Luxshare-Tech took the lead in presenting the XPO (Extra-Dense Pluggable Optics) high-speed node solution. As a core supporting product for high-end computing networks, this solution employs a standardized high-speed interface architecture combined with a streamlined cabling design, significantly optimizing high-speed direct transmission links across nodes and racks. By shortening signal transmission paths and reducing link loss, it effectively enhances the flexibility, scalability, and transmission stability of computing cluster networking. It is fully compatible with advanced application scenarios such as AI supercomputing, AI factories, and high-density server clusters, providing efficient and reliable interconnect support for large-scale computing cluster networking.

Cutting-Edge Computing Component Matrix: Comprehensive Coverage of Core AI Interconnect Scenarios

During the exhibition Luxshare-Tech showcased a full range of core component technologies, covering the two key areas of high-speed interconnect and architectural adaptation to build a complete computing interconnect hardware system. The product portfolio includes a full range of high-speed backplanes, CPO/CPC interconnect architectures, and OSFP external high-speed interconnect solutions. It accommodates both new co-packaged architectures and traditional high-speed interconnect scenarios, achieving comprehensive coverage of high-speed interconnects from the chip level, board level, to the rack level, and fully meeting the high-speed data exchange requirements of AI computing equipment.

Thermal Management and Power Solutions: Efficient Temperature Control and Stable Power Supply to Ensure Long-Term Computing Operation

In addition to high-speed interconnect products, Luxshare-Tech also showcased mature thermal management modules and high-power power delivery accessory solutions to complete the closed-loop computing hardware ecosystem. Among these, the full series of UQD, MQD, and ZQD thermal modules can be precisely adapted to computing devices with different power consumption levels, enabling efficient heat dissipation and reducing the complexity of overall system temperature control. The accompanying high-power power transmission accessories ensure stable power supply to high-density computing nodes, effectively addressing issues such as high-power consumption, high heat generation, and significant power supply pressure in high-end computing equipment, thereby providing dual thermal and power safeguards for the 24/7 stable operation of AI supernodes.

III. Comprehensive Solutions: Empowering Through Integrated Architecture to Build a Full-Chain Computing Ecosystem

ORW Comprehensive Solution 3.0: A Modular, Loosely Coupled Architecture Suitable for Computing Deployments Across All Scenarios

Leveraging its comprehensive hardware product portfolio and core technological expertise, Luxshare-Tech is showcasing the ORW (OpenRack Wide) rack end-to-end solution 3.0. Featuring a centralized-distributed modular architecture, this solution integrates various components and interconnect technologies to achieve unified integration of computing nodes, high-speed data transmission, cooling, and power supply—making it a mature, practical solution for AI supernodes. The entire architecture adopts a loosely coupled, highly scalable design, comprising multiple types of core nodes that work in concert to form a complete computing power system. It can flexibly adapt to the deployment needs of AI data centers of varying scales and computing power densities.

Collaboration Among Multiple Core Nodes to Build a Comprehensive AI Supercomputing Transmission System

CPU Management Node: Featuring a separate centralized node design, it supports flexible CPU-to-GPU ratios such as 1:2 and 1:4. Equipped with an independent liquid-cooling system, it enables full-domain GPU interconnection and redundancy within the same HBD. Primarily responsible for task allocation, logical coordination, and overall management of AI supernodes, it serves as the scheduling core of the entire system.

GPU Computing Nodes: Equipped with a multi-independent-module architecture, these nodes support bidirectional high-speed interconnect expansion, fully unleashing GPU parallel computing and multi-card collaborative computing power. As core computing units, they handle key computing tasks such as AI model training and inference, ensuring efficient computing output from the cluster.

Switch Node: Serving as the system’s high-speed data hub, it relies on bidirectional 224G high-speed links to enable high-speed data exchange and computing synergy within and across racks. This effectively enhances the efficiency of multi-node parallel computing and ensures efficient, seamless data transmission across the entire system.

Cable Box Signal Relay Node: Available in front- and rear-facing versions, it optimizes internal rack cabling through precise front- and rear-output signal routing. This minimizes the length of high-speed cables, reduces signal transmission loss, completes the system’s signal loop, and significantly enhances transmission stability.

High-Speed Cable Bundle Upgrade Module: This module is designed to work with iterable high-speed cable bundle modules, supporting seamless bandwidth upgrades from 224G to 448G. Performance upgrades can be achieved without modifying the overall system architecture, effectively reducing equipment upgrade and O&M costs.

Looking forward, Luxshare-Tech will continue to deepen its focus on the AI computing infrastructure sector, continuously iterate on core technologies in high-speed interconnect, efficient thermal management and system integration, and steadily refine its full-stack product portfolio. Luxshare-Tech is committed to supporting the stability and smooth operation of the global digital and intelligent industry chain and supply chain, while injecting strong technological momentum into the high-quality development of the AI industry.

Meet Us at Upcoming Global Industry Events in 2026-
Discover the latest innovations from Luxshare-Tech at premier industry events worldwide. Visit our team to experience live technology demonstrations, explore cutting-edge connectivity solutions, and discuss how we’re advancing the next generation of AI and data center infrastructure.

CIOE 2026

• September 9–11, 2026

• Hall: 13 Booth: 13A38
  

• Shenzhen World Exhibition & Convention Center, Shenzhen, China  

OCP Global Summit 2026

• October 12–15, 2026

• Booth: A31
  

• San Jose McEnery Convention Center, San Jose, California, USA