Thermal

Luxshare-Tech's Liquid Cooling solutions enable high-density performance with modular components like cold plates for direct-to-chip cooling, immersion tanks for dense compute, CDUs for heat exchange, manifolds for distribution, and BMQC quick-connects for easy installs. Designed for energy efficiency and precise temperature control, they integrate seamlessly with existing infrastructure, supporting real-time monitoring for stable AI/HPC loads while lowering costs and noise, aligned with industry standards for future-proof scalability.

Luxshare-Tech's passive cooling solutions leverage deep innovation in Heat Sinks, Heat Pipes (φ6/φ8 sizes, customizable shapes/lengths), and Vapor Chambers (VC) for PC and server platforms. Vertical integration from raw materials to final modules ensures high-performance, low-cost outcomes with automated production for quality consistency. Tailored to differentiated needs, they provide maintenance-free heat dissipation, boosting efficiency and reliability in dense data center architectures.