Rack-Scale Solutions
Between Racks
Luxshare-Tech's Between Rack Solutions provide reliable, high-speed interconnects for seamless data flow across cabinets in AI data centers.
Luxshare-Tech offers a wide range of high-speed external interconnect solutions, using both "copper" and "optical" technologies, covering a variety of mainstream industry protocols such as Ethernet, IB, PCIE, and CXL.
Product form factors support mainstream industry interfaces such as OSFP, QSFP, and QSFP-DD. In addition to the traditional 1.6T DAC passive copper cable solution, our "lite-active" active cables (ACC & AEC) currently support bandwidths up to 1.6T and significantly extend the transmission distance of copper cables, providing a low-power, cost-effective, and easy-to-deploy reliable solution for short-distance transmission within and across cabinets in AI data centers.
The optical connection utilizes advanced silicon photonics and COB technologies, offering excellent cost and power consumption. Currently, it supports transmission rates up to 1.6T and covers a variety of specifications, including VRx, SRx, DRx, FRx, and AOC, meeting the networking requirements of data centers of varying sizes.
Between Rack Solutions
Explore our Between Rack technology portfolio for next-gen data centers.
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DACLuxshare-Tech’s OSFP 1.6T DAC solution supports 224G attenuation performance requirements based on different system link attenuation design standards.
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IO
Luxshare-Tech’s high-speed IO connectors offer superior performance and support interfaces such as SFP to OSFP with data transmission rate of up to 1.6T.
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AOC
Luxshare-Tech develops and manufactures active optical cable (AOC) solutions based on integrated optics technology, providing end-to-end for next-generation data centers.
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Explore Our Other Products
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Intrepid™ Backplane
Unlock next-gen performance with the Intrepid™ Backplane system, delivering ultra-low crosstalk and insertion loss for high-speed applications.
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CPC & NPC
Luxshare-Tech’s KOOLIO™ CPC and NPC solution is highest-density system on the market.
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Liquid Cooling
Designed for energy efficiency and precise temperature control, our liquid cooling solutions integrate seamlessly with existing infrastructure, supporting real-time monitoring for stable AI/HPC.
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AI Rack
Luxshare-Tech provides cutting-edge interconnect solutions tailored for AI clusters , ensuring optimal performance and scalability. Stand up compute faster, increase rack density, and protect uptime, without added operational complexity. Our AI Rack solution aligns cables, connectors, optics, thermal management, and power into a single, pre-validated configuration so reviews move fast and deployment becomes routine.
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Liquid Cooling
Push your AI and HPC growth further without burning through energy or your hardware. Our modular data center liquid cooling solutions deliver high-density performance with lower energy use and greater system stability. Whether using cold plates for direct-to-chip heat removal, CDUs (liquid-to-liquid and air-to-liquid) for high-efficiency heat exchange, immersion tanks for ultra-dense compute, manifolds for precise distribution, or BMQC blind-mate quick-connects for serviceable, tool-free installs—our solutions remove heat more efficiently and maintain more precise temperature control than traditional air-cooling methods.
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Want to learn more about how we can work with you on your next project? Our global engineering and sales teams are here to answer questions, explore ideas, and help you find the right solution for your data center needs.
