Luxshare-Tech at OCP Global Summit 2026- Scaling Innovation for the AI Era

About the OCP Global Summit 2026

The Open Compute Project (OCP) Global Summit is the premier annual gathering of the open hardware community. It brings together hyperscalers, technology innovators, system designers, ODMs, and industry leaders to accelerate the development of efficient, scalable, and sustainable data center infrastructure through open collaboration.

Under the 2026 theme “Scaling Innovation for the AI Era,” the Summit focuses on the collaborative advancements required to power next-generation AI factories and distributed inference systems, from chip to grid. Priority topics include high-speed interconnects, advanced liquid cooling, power delivery and conversion, rack-scale architectures, and the open standards that enable rapid, interoperable deployment of AI infrastructure at unprecedented scale.

Luxshare-Tech: Enabling the Open AI Infrastructure Ecosystem

Luxshare-Tech operates at the critical intersection of high-performance connectivity, thermal management, and power solutions that define modern AI data centers. Our portfolio, spanning co-packaged copper (CPC), next-generation electrical and optical I/O, liquid-cooled interconnect platforms, solid-state power conversion, and fully integrated AI rack architectures, directly addresses the core challenges prioritized by the OCP community: signal integrity and density at 224G/448G, thermal efficiency under rising module power, modular rack-scale design, and the need for maintainable, high-bandwidth AI fabrics.

As an active contributor to the open compute ecosystem, Luxshare-Tech delivers proven technologies that help hyperscalers and system builders realize the full potential of open, high-density AI infrastructure.

We are excited to preview our live demonstrations, product showcases and many speaking sessions that will take place during OCP this year and we look forward to connecting with industry professionals, customers and partners during the conference.

Live Demonstrations @ OCP Global Summit 2026

Experience next-generation interconnect performance and thermal innovation in real time at the Luxshare-Tech booth:

448G KOOLIO™ CPC to OSFP I/O with Intrepid™ Nexus 448G Backplane Airchannel™

• An innovative end-to-end 448G demonstration showcasing the full link from KOOLIO™ CPC through front-panel I/O and backplane, incorporating external interconnect cables to reflect real-world application scenarios. The system delivers over 90 GHz bandwidth, supports multiple 448G signal transmission modes, and demonstrates the ongoing viability of copper cabling for 448G applications through superior signal integrity and system-level performance.

224G Omnistack™ NPC to XPO Airchannel™

• Showcasing the industry’s latest high-density I/O interface featuring 64 high-speed signal lanes that deliver 12.8T (200 Gbps per lane), with a clear roadmap to 25.6T at 400G per lane. The design incorporates an integrated liquid cold plate shared across paddle cards, supporting higher power consumption and high-voltage applications through blind-mate quick-disconnect connections.

XPO Cold Plate and XBMC Liquid Connectors

• XPO Cold Plate and XBMC liquid connectors, our XPO thermal solution enables 200W to 480W of power in a single module at low pressure drops and f low rates. Our proprietary 3D liquid channel design directly coolant directly over the electronic components with the highest power draw. These areas have micro-channel skived f ins inside the fluid channels to maximize heat transfer. The XBMC blind mate liquid connector plugs and receptacles are designed from the ground up to ensure reliability, compatibility with other vendors, and the lowest possible pressure drops.

224G OSFP 2×8 Liquid Cooling I/O

• Our latest liquid cooling solution engineered for the elevated power demands of OSFP 224G modules. Featuring independent floating cold plates with optimized pressure and flow characteristics, the platform efficiently cools 16 modules while maintaining low pressure drop and controlled case temperatures, delivering a robust, scalable thermal foundation for next-generation high-speed I/O in AI data centers.

Next-Generation Infrastructure

Xuanyuan 3.0 AI Rack

A comprehensive full-rack AI infrastructure solution featuring HVDC power supply, liquid cooling, NPC/CPC, and XPO/NPO technologies. Xuanyuan 3.0 integrates GPU nodes, switch nodes, CPU nodes, and front/rear cable box trays into a systematic platform that combines high-speed copper-optical interconnection, advanced heat dissipation, and efficient powerdelivery. Orthogonal cabling architecture resolves signaltransmission distance and quality challenges while simplifying on-site maintenance and accelerating equipment recovery for large-scale GPU deployments supporting multiple independent high bandwidth domains.

Solid State Transformer (SST)

Optimized to deliver unprecedented speed-to-power for AI data centers, enabling faster deployment while future-proofing energy infrastructure. The Nova-Link Series offers high power density, exceptional efficiency (peak 99%), high reliability with N+X redundancy, modular plug-and-play installation, and broad compatibility with global grid standards, reducing total cost of ownership for mission-critical AI infrastructure.

Speaking Session

Join Luxshare-Tech experts and partners as they share technical insights on the interconnect, power and thermal technologies shaping the future of AI data centers:

Copper Interconnect Innovations for Realizing 400G Electrical

• Wednesday, October 14  |  8:45–9:00 AM  |  SJCC – Lower Level – LL21BC

• Speakers: Andrew Kim & Jinhua Chen

• This session covers advances in interconnect technologies enabling high-performance 400G electrical interconnects, with primary focus on the KOOLIO™ CPC connector and a novel HSIO connector. Updates will include progress on connector loss, bandwidth, ILD, and consistency for the 400G version, along with simulations, measurements, and design approaches for front-panel and backplane applications supporting DAC, AEC, ACC, and AOC assemblies.

OSFP 2×8 Liquid Cooling I/O Solution – Enabling High-Performance Thermal Management for 1600G AI Data Center Interconnects

• Monday, October 12  |  1:40–2:00 PM  |  SJCC – Concourse Level – 212

• Speaker: Robbie Xu

• As 1600G optical modules become mainstream and power consumption rises with 224G SerDes, traditional air cooling approaches its limits. This presentation details how the OSFP 2×8 Liquid Cooling I/O solution extends liquid cooling into the network interconnect domain, providing efficient and reliable thermal platforms for next-generation high-bandwidth switches and AI clusters.

400G/lane Optics Module Connectors

• Wednesday, October 14  |  11:05–11:30 AM  |  SJCC – Concourse Level – 210AE

• Speakers (Panel): Robbie Xu (Luxshare-Tech), Sam Kocsis, Terry Little, Nathan Tracy, moderated by Andy Bechtolsheim

Direct Medium-Voltage-to-800VDC Conversion for AI Data Centers

• Wednesday, October 14  |  2:05–2:20 PM  |  SJCC - Concourse Level - Expo Hall

• Speaker: Jingkui Shi, CEO of the Joint Venture between Luxshare-Tech and ZINSIGHT Technology

• As AI data centers move toward higher rack power and 800VDC distribution, facility-level power conversion is being re-evaluated. This session explores direct medium-voltage-to-800VDC conversion, drawing on development experience from 13.8-kV and 35-kV solid-state transformer platforms.

Connect With Us

Visit the Luxshare-Tech booth #A31 at the OCP Global Summit 2026 to experience these live demonstrations, explore our product displays, and engage directly with our engineering and product teams. We look forward to discussing how Luxshare-Tech solutions can support your AI infrastructure roadmap and accelerate deployment of next-generation open compute systems.