​Luxshare-Tech Showcases Next-Generation AI Optical-Copper Interconnect Solutions at OCTS 2026

Beijing, CN - July 9, 2026 – Luxshare-Tech, a global partner and innovative manufacturer of high-performance core component solutions, attended the Open Computing Tech Summit, jointly hosted by OCP and OCTC. Under the theme “Boundless Intelligent Computing: Open, Diverse, Scalable,” the conference focused on full-chain innovation in AI computing infrastructure. As a core partner in the open computing ecosystem, Luxshare-Tech showcased AI cabinet infrastructure components—including a 448G CPC live demo, the Nexus Cable Cartridge, and a 5000A liquid-cooled busbar—at the event, winning the Best Innovation Award. Luxshare-Tech also presented next-generation optical interconnect and ultra-high-speed copper interconnect solutions at both the main and parallel forums, centered on its “optical and copper in parallel” technology roadmap. As the lead drafter of the GW-level Open AI Computing Center Framework White Paper, Luxshare-Tech is fully committed to empowering the development of the open computing ecosystem.

Luxshare-Tech Booth at OCTS 2026

As large AI models and intelligent agent technologies are deployed at scale, the demand for interconnect bandwidth in computing clusters continues to surge, data center interconnects are gradually evolving from 1.6T to 3.2T, 6.4T, and even 12.8T. The “optical-copper convergence” approach—where long-distance communication relies on optical cables while short-distance interconnects within racks rely on high-speed copper cables—has become an inevitable trend in the development of high-density AI data centers. Luxshare-Tech has deeply engaged in full-stack R&D across optoelectronic interconnects, thermal management, and power supplies, simultaneously expanding into both high-speed optical and copper interconnect technology tracks to provide comprehensive end-to-end interconnect support for next-generation intelligent computing centers.

Luxshare-Tech Received the Best Innovation Award at OCTS 2026

Insights into Next-Generation AI Optical Interconnect Roadmap: Coordinated Deployment of CPO, NPO, and XPO

At the main forum, Peng Xiaowei, Senior Manager of Optical Products at Luxshare-Tech, delivered a presentation titled “Next-Generation AI Optical Interconnect—NPO, CPO, and XPO.” He pointed out that the expansion of computing power is driving the upgrade of optoelectronic integration architectures. The three mainstream optical interconnect solutions — NPO (near-package optics), CPO (co-package optics), and XPO (eXtra-Dense Pluggable Optics) — each offer distinct advantages in terms of transmission performance, data center maintainability, thermal management, and total cost of ownership, and each is best suited for specific scenarios.

From the perspective of data center users who prioritize business value over technological fervor, Luxshare-Tech believes these three approaches should advance in parallel rather than be in mutually exclusive competition. Consequently, Luxshare-Tech is actively participating in the development of standards such as NPO, ELSFP, and XPO, while also investing significant resources in the development and implementation of corresponding products. In conjunction with copper interconnects, thermal management, and power supply products, Luxshare-Tech continues to provide comprehensive interconnect solutions tailored to all scenarios for next-generation intelligent computing centers.

Senior Product Manager Peng Xiaowei Presented “Next-Generation AI Optical Interconnect—NPO, CPO, and XPO.” 

Analysis of High-Speed Copper Interconnect Trends and Solutions: Building the Foundation for 224G/448G High-Speed Copper Interconnects

At the GW-Scale Open AIDC sub-forum, Jin Loong, Senior Product Manager at Luxshare-Tech, delivered a technical presentation titled “Introduction to AI Rack High-Speed Interconnect Solutions and Discussion on the Feasibility of 448G High-Speed Copper Interconnects.” The presentation examined high-speed interconnect trends across the three expansion scenarios of Scale-Up, Scale-Out, and Scale-Across, outlining trends in high-speed interconnect development. Citing the implementation philosophy of leading customers — “use copper whenever possible, and resort to optical for long distances”—the presentation comprehensively showcased Luxshare-Tech’s 224G hybrid optical-copper end-to-end interconnect solution, as well as its exploratory 448G copper interconnect solution covering the entire link, including OptaMax cable, NPC connectors, BP connectors, and IO connectors.

Senior Product Manager Jin Loong Presented “Introduction to AI Rack High-Speed Interconnect Solutions and Discussion on the Feasibility of 448G High-Speed Copper Interconnects.”

For the 448G copper interconnect solution, Luxshare-Tech established a full-link configuration using network analyzers and multiple sets of cables and connectors. Through actual test data, Luxshare-Tech verified that the relevant CPC channel bandwidth can exceed 100GHz, fully demonstrating that 448G high-speed copper interconnects are capable of large-scale commercial deployment, thereby addressing the hardware gap in short-distance high-speed interconnects within server racks.

Proactively Planning Foundational Technologies to Continuously Strengthen the Core Infrastructure for AI Computing Interconnects

Over the past decade, Luxshare-Tech has been deeply involved in the development of industry standards and open organizations such as OCP, XPO, ACC, and SDM4 MCF. The company has continuously contributed standardized hardware solutions — including connectors, high-speed cables, liquid-cooled power supplies, and optoelectronic modules — to comprehensively enrich the open computing industry supply chain. The technical presentations at the two forums during this conference clearly demonstrated Luxshare-Tech’s “parallel development of optical and copper” strategy and its interconnect product portfolio, which can fully address all interconnect requirements across the entire spectrum — from within cabinets to between clusters — in next-generation intelligent computing centers.

Looking ahead to the construction of future hyperscale intelligent computing data centers, Luxshare-Tech will continue to deepen its expertise in foundational technologies, proactively conduct research and iterate on products, and collaborate with partners across the industry chain to provide a comprehensive suite of optical and electrical interconnects.

Meet Us at Upcoming Global Industry Events in 2026-
Discover the latest innovations from Luxshare-Tech at premier industry events worldwide. Visit our team to experience live technology demonstrations, explore cutting-edge connectivity solutions, and discuss how we’re advancing the next generation of AI and data center infrastructure.

CIOE 2026

• September 9–11, 2026

• Hall: 13 Booth: 13A38

• Shenzhen World Exhibition & Convention Center, Shenzhen, China  

OCP Global Summit 2026

• October 12–15, 2026

• Booth: A31

• San Jose McEnery Convention Center, San Jose, California, USA