​OCP Global Summit 2025 Recap: The AI Infrastructure Inflection Point

The Open Compute Project’s 2025 Global Summit reaffirmed what many in the AI infrastructure world already suspected, we are entering a new paradigm in which racks, power, interconnect, and cooling must be designed in concert, not as isolated subsystems. This year’s announcements made it clear that “AI factories” are more than a metaphor — they’re the next architectural mandate, signaling a fundamental shift toward integrated, rack-scale system design.

Luxshare-Tech Booth @ OCP Global Summit 2025

This sentiment was reinforced throughout the summit as AI infrastructure took center stage. The industry spotlight shifted decisively toward rack-scale systems, open standards, power modernization, and design interoperability. AMD’s unveiling of Helios, a rack-scale AI platform built on the Open Rack Wide (ORW) specification, brought attention to how compute, memory, switching, and serviceability must now merge at the rack level. NVIDIA, meanwhile, further advanced the concept of “AI factories” with next-generation rack designs featuring liquid cooling, modular midplanes, and evolving high-voltage DC power architectures. Together, these announcements signaled a collective movement from component-level innovation to fully integrated system engineering.

Beyond those marquee platform reveals, the Summit also featured ecosystem initiatives aimed at enabling smoother transitions in networking and compute. OCP introduced ESUN (Ethernet for Scale-Up Networking), a new workstream focused on adapting Ethernet to the high-bandwidth, low-latency demands of accelerated compute fabrics. Many technical sessions reinforced the importance of reliability, system efficiency, and performance validation as core pillars for next-generation data centers. Across power, interconnect, and thermal domains, the message was clear, infrastructure must become simultaneously more integrated, more efficient, and more scalable to keep pace with AI-driven workloads.

On the optics side, optical solutions targeting 448G will be limited by bandwidth requirements, which can only be met through EML and LNTF technologies. Low-power solutions such as VCSEL are gaining strong interest from hyperscalers. Meanwhile, CPO is expected to reach medium-volume mass production, driven by Meta’s demonstrated success in achieving high reliability and low service costs. Nvidia and Broadcom, together with Micas and Delta, are actively shaping the technology roadmap. Broadcom has also reached an important milestone through its collaboration with TSMC on the SiPh COUP process and advanced packaging, significantly improving product efficiency.

Meta is planning large-scale deployments starting in 2026, signaling a major opportunity for the optical interconnect industry. The 800G market demand is expected to reach up to 50 million units by that time, with Meta alone projected to require around 15 million units, primarily 2xFR4. Luxshare-Tech’s advanced planning will enable us take advantage of this opportunity when the market takes off.

Luxshare-Tech’s product and solution showcase directly reflected this evolution. Our product portfolio, spanning high-speed interconnects, scalable power systems, and thermal architectures, is purpose-built for this new, unified model of design. In addition to the industry news and announcements from the conference, we came away with five key takeaways that will help guide what comes next.

6 Key Takeaways-

1. Design interoperability early. As rack-first architecture becomes default, interconnect, power, cooling, and structure must be co-designed.

2. Support transition to hybrid voltage domains. Many deployments will straddle 48 V and 800 V domains during transition. Modular DC-DC solutions, staged rollouts, and voltage-agnostic design will be critical.

3. Engineer for observability. Every link and power path must be diagnostically visible. Patterns of failure must be predictable and detectable before they become critical.

4. Align on thermal discipline. Cooling, airflow, leak management, and airflow paths aren’t features — they are constraints. Interconnect and power modules must live within sound thermal budgets.

5. The interconnect and power solutions you choose today must provide the scalability and reliability needed for future generations. CPC at 448 G/224 G, 1.6 T AEC readiness, and modular high-efficiency power architectures are not incremental, they’re foundational to building data centers that can evolve with emerging AI performance demands.

6. Capitalize on the optical transition. As the industry accelerates toward 448 G and 800 G deployments, demand for advanced optical technologies such as EML, LNTF, and VCSEL-based solutions is expanding rapidly. Large-scale adoption of CPO and Meta’s planned 2026 rollouts mark a pivotal inflection point for the optical interconnect market. Luxshare-Tech’s early investments in design, packaging, and process innovation position us to meet this surge in volume and performance requirements as hyperscale AI infrastructure scales globally.

Building on these themes, Luxshare-Tech’s demonstrated our readiness to tackle what’s next with an array of next-generation products and solutions to help accelerate AI deployments, here are a few highlights from the conference. 

AI Rack 

Our AI Rack displayed how our complete portfolio of core component solutions covering electrical, optical, thermal, and power technologies come together to enable scalable, high-density AI and HPC architectures. 

Luxshare-Tech's Total Solution for AI Rack 

448G & 224G CPC 

Luxshare-Tech’s CPC (co-packaged copper) demos showed how we can deliver high-density, low-loss interconnects with robust reliability and manageable bend profiles, crucial for dense node-to-node fabrics within racks. In a context where scale-up Ethernet and cross-bar fabrics may demand copper lanes more than ever, our CPC solution is a critical enabler.

448G & 224G Co-Packaged Copper Live Demo 

1.6T OSFP AEC 

Our 1.6 T OSFP AEC live demo demonstrated that we are capable of stepping into the next generation of link performance. The balance among reach, power, and SI headroom that we have designed into that module aligns squarely with what future racks will require: longer links, higher densities, and lower overhead.

1.6T AEC & 224G LiteActive Cable Backplane Live Demo

Power & DC Architecture 

Luxshare-Tech’s power modules, 48 V PwrLink assemblies, and DC-DC converter designs are built to support both the current 48 V/12 V ecosystems and future 800 V or higher-voltage transitions. As OCP-level architecture shifts toward higher voltage distribution, our modular, telemetry-aware power infrastructure becomes a compelling enabler.

Next-Gen Power Module Live Demo

Expert Speaking Sessions 

Beyond demonstrations, we shared our technical expertise in two speaking sessions. Andrew Kim presented “Extending Copper Interconnects to 448G: Innovations Overcoming Conventional Limitations”, where he walked through design strategies and trade-offs for impedance control, noise margin, equalization, and layout constraints. Robbie Xu followed in “Enabling Next-Gen AI Infrastructure with 224G+ Cable Cartridge Solutions”, detailing how Luxshare’s cable cartridge designs deliver density, thermal compliance, and low-loss signal paths critical for genomics, AI, and beyond.

Robbie Xu, Director of Product & Marketing, presenting Enabling Next-Gen AI Infrastructure with 224G+ Cable Cartridge Solutions

Andrew Kim, Director of Engineering, presenting Extending Copper Interconnects to 448G: Innovations Overcoming Conventional Limitations

The OCP Global Summit 2025 delivered a clear message: we’re past incremental upgrades. The next phase of AI infrastructure demands co-designed racks, scalable high-speed interconnects, efficient high-voltage power distribution, and integrated thermal management, all working together to deliver the performance, reliability, and density that next-generation data centers require. Luxshare-Tech is building for what’s next, the solutions we showcased represent the bridge between today’s challenges and tomorrow’s systems. Contact us to learn more about Luxshare-Tech’s products & solutions

Luxshare-Tech is building for what’s next, the solutions we showcased represent the bridge between today’s challenges and tomorrow’s systems.

Contact us to learn more about Luxshare-Tech’s products & solutions