In the Era of AI, Luxshare-Tech’s KOOLIO CPC Solution Unleashes 224G Information Transmission

In the era of artificial intelligence, information barriers are dissipating. On the platform side, the parameter scale of large AI models has surpassed the trillion level, and the global traffic carried by cloud computing and data centers is growing exponentially. With the explosive growth of scenarios in the Internet of Everything, data transmission rates are surging at a pace of "quadrupling every three years", rapidly evolving from 112G to 224G(per lane) and even advancing toward 448G. Amid this wave of technological revolution, traditional interconnection technologies are facing a variety of significant challenges. The ultra-high-speed transmission of data urgently needs interconnection technologies to "break free" from existing constraints.

CPC Technology Frontiers- Breaking down the walls of information transmission

In terms of spatial layout, as the demand for ultra-high density data transmission requires up to thousands of differential signaling channels, the traditional PCB wiring space has appeared to be inadequate, and the “onboard-line-outgoing" program also fails to match the high-density channel requirements of the latest generation of chips. In terms of signal transmission quality, system link loss and crosstalk targets are imposing increasingly high demands on connectors and cables for high-speed signals.

Luxshare-Tech’s 224G KOOLIO CPC full-link technology solution systematically addresses these challenges with its ultra high-density design, extremely low loss and crosstalk control, as well as its low-power port characteristics.

CPC technology, known as Co-Packaged Copper, is an innovative interconnection solution that integrates a high-speed connector directly with the chip substrate, designed for ultra-high density and ultra-high speed data transmission requirements. By co-packaging, CPC technology greatly shortens the signal transmission path, effectively reduces signal transmission loss and improves data transmission performance.

The Choice of Breaking Through the Barriers- Interpretation of Luxshare-Tech’s 224G KOOLIO CPC Solution

While CPC technology offers numerous advantages, it also comes with a new set of challenges. These include the significantly increased complexity of substrate and OSAT manufacturing processes, the need for power supply and thermal dissipating components to be closely fit to the chip layout, which will limit the flexibility of the design, and the subsequent maintenance challenges if the CPC base is permanently soldered to the substrate. Fortunately, Luxshare-Tech, in the practice of tackling the above new CPC technology challenges together with customers, has effectively solved these issues by launching the 512-channel (1024 differential pairs) high-density and high-speed KOOLIO CPC interconnection solution.

Luxshare-Tech’s 512-channel, high-density, high-speed KOOLIO CPC interconnection solution integrates 16 connectors (64 pairs of differential signals per connector) on a substrate measuring just 110 mm x 110 mm, achieving a single-channel rate of up to 224 Gbps. This solution incorporates multiple cutting-edge technologies, offering a range of significant benefits such as low power consumption, excellent signal integrity, and acompact layout. It provides a more efficient and reliable interconnection solution for applications such as data centers and AI computing.

Technical Advantages-

    1. Fully-shielded connector structure: The connectors feature an all-metal shielding, delivering industry-leading crosstalk suppression performance.

    2. Compatibility and flexibility: Supports 31 AWG wire diameter, compatible with existing mainstream cable standards. Additionally, by adjusting the connector design, it can accommodate larger wire diameters (e.g., 28 AWG) or different configurations (e.g., 32 differential pairs), satisfying diverse application requirements.

    3. High-density CPC system: One of the highest-density CPC solutions in the industry nowadays, it maximizes signal density while minimizing substrate routing loss.

    4. Simplified manufacturing process: No additional reflow soldering process is required for the connector during substrate integration, reducing production complexity and costs. When the application requirements for switch chip escalate to 1,024 high-speed channels with a single-channel rate of 224G bps, a side-by-side layout interconnection solution becomes one of the viable options. This solution utilizes two 110mm x 110mm substratesco-located within the same node. However, with such high-density and high-speed application requirements, cable routing may face challenges of excessive density and limited space.

Versatile and Multifunctional- Interpretation of Interconnection Scenario Application-

    1. Interpretation of Interconnection Scenario Application High-density GPU interconnection configuration: Each GPU (Graphics) is equipped with 4 connectors, each supporting 64 pairs of differential signals (DP), which enables dense interconnection of 256 pairs of high-speed channels for GPUs.

    2. Optimized substrate space design: Each GPU uses an 80mm substrate edge area to ensure that high-speed signals are led out close to each other, minimizing routing losses.

    3. Multi-unit parallel integration capability: Supports the integration of up to 4 GPUs in parallel, enabling the construction of ultra-large-scale computing clusters within a compact layout while maintaining system modularity and scalability.

    4. Ultra-thin vertical packaging: The overall vertical height (Z-axis) can be controlled within 20mm, providing the ultimate space utilization for high-density servers and switch equipment. 

Luxshare-Tech’s 224G CPC full-link technology is also applicable to wafer-level applications. By configuring 48 connectors around a 300mm wafer, a staggering 256Tb/s total bandwidth can be achieved, which fully meets the urgent demands for massive data transmission in scenarios such as AI supercomputing and optical communication backbone networks.

At the OCP Global Summit 2024, Luxshare-Tech and Microsoft jointly demonstrated an application case based on the 1.6T CPC full link, which attracted considerable attention and high recognition from the industry. As data transmission rates continue to rise, the 224G CPC interconnection technology, with its low-power consumption, superior signal integrity, and compact layout design, will contribute to technological innovation and performance leaps in data centers and AI infrastructures. 

From 112G to 224G and to 448G, and from copper interconnection evolving to Optical- Electrical Co-Integration, Luxshare-Tech has always been at the forefront of high-speed interconnection innovation. We are firmly convinced that only by closely focusing on the demands of customer scenarios and driving progress through an open ecology can we make every byte of data transmission faster, more stable, and "greener". In the future, we will continue to make efforts to the CPC technology matrix and collaborate with our global partners to explore the boundless possibilities of connectivity in the intelligent era.