Reconstructing the Future of Intelligent Computing with CPO & CPC: A Dual-Track Strategy Empowering Global Data Center Innovation

Across industries, the demand for computing power is growing explosively - with limited space and resources, sustaining such rapid growth is increasingly difficult. On June 4, Broadcom officially launched the Tomahawk® 6 switch chip series, featuring a groundbreaking 102.4Tbps switching capacity per chip—doubling current Ethernet bandwidth. This upgrade fuels the next generation of scale-up/scale-out AI networks. This ultra-high switching capacity places new demands on interconnect technologies, including signal integrity, thermal management, and power efficiency. This creates an ideal opportunity for the widespread adoption of CPO (Co-Packaged Optics). CPO enables high-speed, stable optical signal transmission to support data interconnects for AI clusters, while reducing reliance on standalone optical transceivers—lowering power usage and cabling complexity for efficient, low-power hyperscale AI networks. Alongside CPO, CPC (Co-Packaged Copper) interconnects are proving indispensable in high-density, short-range applications due to their efficiency advantages. This article provides an in-depth look at how Luxshare-Tech, as a leading player in high-speed interconnect technology, is achieving dual breakthroughs in both CPO and CPC, delivering powerful support for computing performance enhancement. With full-stack capabilities, the company is driving global data centers toward a high-density, energy-efficient future.

CPO Technology- Luxshare-Tech's Breakthrough Journey

1. What is CPO? Why is it critical for the AI era?

CPO (Co-Packaged Optics) integrates optical engines directly with switch chips, overcoming the physical limitations of traditional pluggable modules and increasing bandwidth density by over 50%. For AI model training and supercomputing centers, CPO resolves the core dilemma of massive data throughput vs. soaring energy costs and is hailed as the “the ultimate solution for next-gen data center interconnects.”

2. From Patents to Standards: A Leading Position 

CPO technology completely subverts the traditional pluggable optical module architecture by co-packaging the optical engine and the switching chip, achieving a leapfrog breakthrough of reducing power consumption by 30% and increasing bandwidth density by more than 50%.

    • Core Patents: Luxshare-Tech's self-developed CPO solution integrates optical transceivers, optoelectronic conversion chips, and processors, shrinking module size by 40% and solving the challenge of balancing density with miniaturization. Patents have been filed in the U.S., China and other regions.

    • Standards Leadership: Luxshare-Tech serves as the chair of the CPO Standards Working Group under the CCITA. The company led the development of the “TechnicalInterface Requirements for Optical Interconnects of Semiconductor Integrated Circuits” (T/CESA 1266-2023), which was officially implemented in August 2023.

3. Full Supply Chain Collaboration: From Lab to Mass Production

Luxshare-Tech is accelerating CPO commercialization through vertical integration and open collaboration.

    • Upstream: Co-developing optical/electrical chips with top global silicon photonics vendors to optimize signal integrity and power consumption.• Midstream: Advancing 3D packaging technology and glass substrate applications to improve thermal and integration density, laying the foundation for the next generation of ultra-compact CPO modules.

    • Downstream: Cooperate with equipment manufacturers to develop CPO prototypes, and jointly build a DEMO verification platform with major chip manufacturers to promote technology adaptation to mainstream data center architecture.

4. Application Prospects: A “Golden Track” for the AI Era

CPO technology is mainly aimed at high-computing scenarios such as supercomputing centers and AI training clusters, and its core advantages include:

    • Ultra-High Bandwidth: Supports 1.6Tbps+ transmission for massive AI workloads.

    • Energy Efficiency: 30% less power, optimizing PUE values.

    • Low Latency: Millimeter-level signal paths ensure real-time inference reliability.

CPC Technology- High-Performance Solution for the Mainstream Market

CPC (Co-Packaged Copper) integrates high-speed connectors directly with chip substrates for ultra-high-density, ultra-high-speed data transmission. This innovative approach greatly shortens signal transmission paths, reduces signal loss, and boosts overall transmission performance.

Luxshare-Tech's KOOLIO CPC 224G solution has become the industry benchmark

    • Technical Superiority: Based on 224Gbps PAM4 modulation technology, it adopts high-density design, 360° full-shielding structure and "0 Stub" structural design, with high bandwidth and low crosstalk, providing a stable and reliable data channel for AI computing centers.

    • System Integration: Supporting cold plate liquid cooling system and high-power DC power supply, forming an integrated solution of “connection-heat dissipation-power supply,” has been recognized by top customers.

    • Market Success: The copper interconnect product line has entered the supply chain of the world’s top three data centers, optical modules and thermal solutions have been delivered in batches to top North American projects, and the compound annual growth rate of the communications business in the past three years far exceeds the industry baseline.

Recent Milestones

    • October 2024, OCP Global Summit: Luxshare-Tech and Microsoft showcased a 1.6T CPC full-link demo—drawing wide acclaim.

    • April 2025, ETH-X Super Node Prototype: provided KOOLIO Co-Packaged Copper (CPC) solution, OmniStack Near-Packaged Copper (NPC) solution, and Intrepid Cable Cartridge high-speed cable backplane solution, contributing to the proposal and practice of ETH-X standards based on next-generation high-speed interconnect technologies.

The Future of 224G/448G Interconnects

These technologies will enable revolutionary upgrades in data center and AI infrastructure through:

    • Lower power

    • Enhanced signal integrity

    • Compact design

CPO + CPC

Luxshare-Tech, through the dual-track strategy of “CPO tackling high-end + CPC covering mainstream,” can not only use CPO to serve ultra-large-scale intelligent computing centers, but also use CPC to meet the high cost-performance needs of enterprise customers, forming a “technology complementarity + full market coverage” competitive advantage.

Core Capabilities- Full-chain advantages from silicon photonics accumulation to intelligent manufacturing

1. Silicon Photonics Technology Accumulation

Luxshare-Tech has been deeply involved in the field of single-mode pluggable optical modules for many years, and has accumulated core technologies such as silicon photonic chip design, high-precision packaging, and automated testing. Its developed silicon photonic LPO (Linear Pluggable Optics) module simplifies the DSP chip to achieve low power consumption and low cost. This development experience can be directly transferred to CPO development to accelerate technology conversion.

2. Intelligent Manufacturing

    • Global Presence: 20+ manufacturing sites in Asia and the Americas provide vertically integrated services mold development, precision machining and automated assembly.

    • Quality Assurance: Labs certified towards ISO/IEC 17025, support mass production capacity of high-speed products.

3. Ecosystem Collaboration

Deep participation in OCP, IEEE, ODCC and other industry organizations, jointly developing next-generation technologies with chip giants such as Intel, Broadcom, and leading cloud vendors such as Tencent and Alibaba.1.6T CPC Full-Link Application demo by Luxshare-Tech & Microsoft at OCP 2024 From the defining CPO standards to leading the development of CPC solutions, Luxshare-Tech is writing a new chapter in the global high-speed interconnect field with innovation. In the future, we will continue to deepen the technical integration of CPO and CPC, promote optoelectronic interconnect to move toward a higher-speed era, and build a more efficient and greener digital foundation for AI, cloud computing, and the Internet of Everything.

1.6T CPC Full-Link Application demo by Luxshare-Tech & Microsoft at OCP 2024

Defining the Future of Global Optoelectronic Interconnects

From the defining CPO standards to leading the development of CPC solutions, Luxshare-Tech is writing a new chapter in the global high-speed interconnect field with innovation. In the future, we will continue to deepen the technical integration of CPO and CPC, promote optoelectronic interconnect to move toward a higher-speed era, and build a more efficient and greener digital foundation for AI, cloud computing, and the Internet of Everything.