Luxshare-Tech Showcases 224G and 448G Interconnect Innovations at DesignCon 2026

Santa Clara, CA – February 25, 2026 – Luxshare-Tech, a global partner and innovative manufacturer of high-performance core component solutions, will showcase its latest advancements in enabling next-generation 224G and 448G interconnects at DesignCon 2026, taking place February 24–26 at the Santa Clara Convention Center. At booth #839, Luxshare-Tech will present live demonstrations and product showcases that address the escalating connectivity demands of AI, high-performance computing (HPC) and next-generation data center architectures.

With the core constraint in AI data center ecosystems now moving from processing power to seamless interconnectivity, operators need scalable, high-speed options that can handle the explosive expansion of intensive AI applications. Luxshare-Tech is spearheading progress in interconnect innovations across rack-scale architecture, partnering extensively with a broad network of collaborators to provide outstanding data throughput, energy optimization and scalable reliability.

Visitors to booth #839 can experience a series of live demonstrations highlighting Luxshare-Tech’s breakthrough solutions in high-speed copper interconnects. These include the 448G KOOLIO™ CPC to OSFP Airchannel™, an innovative end-to-end 448G demonstration that showcases the full link from KOOLIO™ CPC to front-panel I/O, incorporating external interconnect cables to simulate real-world application scenarios. The system supports over 90GHz bandwidth and accommodates multiple 448G signal transmission modes, demonstrating the ongoing viability of copper cabling for 448G applications through superior system performance. Complimenting this is the 224G KOOLIO™ CPC to CPC, which maintains superior signal integrity for reliable 224G performance with stable results during complex routing, optimal bend radius, and minimized impact from torsion on the cable assembly and twinax.

Live demonstrations also feature Luxshare-Tech’s 1.6T OSFP AEC, which delivers reliable performance over 4-meter 27 AWG and 3-meter 30 AWG reaches. In complement, Luxshare-Tech will showcase their 1.6T ACC, emphasizing cable assembly routing and installation reliability with superior signal integrity that remains stable during complex routing, optimal bend radius for maximized flexibility, and minimal BER variation under torsion and twist conditions.

Additionally, Luxshare-Tech will be showcasing their latest OSFP-XD PCIe 6.0 AEC, which extends copper cable reach for PCIe and CXL signals in a high-density OSFP-XD form factor. Powered by an industry leading PCIe 6.0 retimer, it achieves up to 7-meter transmission distances and supports PCIe 6 x16 for a total maximum bandwidth of 256GB/s, making it suitable for both inter-rack and intra-rack connectivity in evolving disaggregated computing infrastructures such as JBOG, JBOM, and JBOX.

Beyond the live demonstrations, Luxshare-Tech will showcase a range of complementary products and technologies, encompassing high-speed interconnects, optical transceivers, thermal management solutions, and power interconnects and management systems. These offerings collectively support the comprehensive needs of advanced AI-driven data centers.

Luxshare-Tech experts will also lead an insightful tutorial session and present in a technical paper session providing deeper technical perspectives on the technologies shaping next-generation high-speed architectures. On Tuesday, February 24, from 2:00 PM to 4:30 PM, the session "Enabling 224G/448G Co-Packaged Copper Architectures" will explore how, as data rates scale to 224G and 448G with increasing signal pair density, Luxshare-Tech’s Co-Packaged Copper (CPC) solution addresses this head-on with advanced connector designs, robust twinax cables and high-performance backplane/IO assemblies tailored for high-speed ASICs.

On Wednesday, February 25, from 3:00 PM to 3:45 PM, the session "Top Side Interconnect Enabling for PCIe 7.0 and Beyond" will address the optimization of signal integrity in interconnect components to enable PCIe at 128Gbps and higher rates. Experimental results from this proof-of-concept demonstrate substantial reductions in crosstalk and reflections, enabling robust PCIe 7.0 operation at 128Gbps and providing a scalable path for future PCIe generations.

Luxshare-Tech continues to push the boundaries of high-speed interconnect technology to meet the evolving demands of AI-driven data centers. Industry professionals, customers, partners and media are encouraged to follow our ongoing advancements and connect with our team to explore how these innovations can support next-generation architectures.

Press Contact: Christopher Beadon 

Email: Christopher.beadon@luxshare-ict.com

About Luxshare-Tech

Luxshare-Tech is a global partner and innovative manufacturer of high-performance core component solutions for next-generation data centers, offering fully integrated, cabinet-level interconnect, optical, thermal and power technologies with unmatched reliability and scalability. By unifying advanced signal integrity, precision mechanical design, intelligent manufacturing and global R&D, we partner with customers to design, build and deliver solutions that simplify complexity, accelerate development and reduce risk. Our vertically integrated model and connection to Luxshare-ICT’s global manufacturing footprint enable faster time to market and seamless compatibility across every system layer. Guided by deep technical expertise and a commitment to continuous innovation, Luxshare-Tech invests in pre-research, advanced materials science and industry collaboration — holding more than 1,500 global patents across core hardware domains. Our engineering teams play an active role in defining emerging standards and supporting customers with co-design, validation and testing across U.S. and global facilities. Together with our customers, we’re not just meeting today’s demands. We’re building for what’s next. Visit: luxshare-tech.com