​Luxshare-Tech Showcases XPO and Key Achievements in High-Speed Interconnects at OFC 2026

Watch Luxshare-Tech's Booth Highlight for OFC 2026

On March 17 to 19, 2026, OFC, the premier global event in the optical communications industry, was held at Los Angeles Convention Center. As a global leader in high-speed interconnect technology, Luxshare-Tech showcased its XPO (eXtra-Dense Pluggable Optics) end-to-end solution, 224G/448G copper interconnect core products, and a broad portfolio of high-speed interconnect solutions. With a full-link, full-stack technology strategy, Luxshare-Tech has set itself up to precisely address the extreme interconnect demands of data centers in the AI era. Among these, the XPO liquid-cooled connector and optical module solutions were the core highlights of this exhibition, fully demonstrating Luxshare-Tech’s technological expertise and innovative capabilities in next-generation ultra-high-density optical interconnects.

Luxshare-Tech Booth at OFC 2026

Key Highlight: XPO (eXtra-Dense Pluggable Optics) Comprehensive Solutions Make a Grand Debut

At the exhibition, Luxshare-Tech showcased the first of its kind system level architecture for XPO, comprehensively showcasing breakthroughs in ultra-high-density interconnect technology for next-generation AI data centers. As a new-generation standard for liquid-cooled connectors and pluggable optical modules led by Arista, XPO represents a key direction for overcoming current bottlenecks in optical interconnect density and thermal management. As a key founding member of the XPO MSA, Luxshare-Tech has been deeply involved in defining the standard and developing new innovative products to support the project. Leveraging its vertical integration advantages across three major fields—electrical interconnects, optical interconnects, and liquid cooling systems—the company has developed a complete set of mature XPO interconnect solutions.

Luxshare-Tech XPO Demo

On the expo floor, Luxshare-Tech’s 12.8T XPO connectors, optical modules, and 204.8T switch simulation system attracted significant attention from attendees. This solution addresses the industry’s dual pain points of density and thermal management. Its built-in liquid-cooled cold plate overcomes the limitations of air cooling, delivering a maximum thermal capacity of 400W. While retaining the advantages of pluggable modules, such as ease of maintenance and flexible configuration, it effectively avoids the industry-wide challenge of complex CPO maintenance. In terms of core performance, a single module achieves a bandwidth of 12.8T (64 channels × 200G), with a total 1RU rack bandwidth of 204.8T —a fourfold increase over traditional OSFP. The interfaces and links cover all application scenarios in AI data centers, significantly reducing data center construction costs and transmission latency while substantially enhancing overall system reliability.

XPO Demo Close-up Shot

The unveiling of this comprehensive XPO solution not only demonstrates Luxshare-Tech’s technical prowess in the field of ultra-high-density optical interconnect but also underscores its pivotal role in shaping next-generation optical interconnect standards and bringing products to market, providing a practical and feasible implementation plan for the technological upgrade of global AI data center optical interconnects.

Dual-Track Approach: 224G/448G Copper Interconnect Solutions for Diverse Scenarios

While continuing to deepen its expertise in next-generation ultra-high-density optical interconnect technology, Luxshare-Tech also showcased a series of mature 224G/448G copper interconnect innovation products. These stable, high-efficiency end-to-end solutions meet the high-speed interconnect demands of today’s AI data centers, further refining the company’s strategy of “advancing both optical and copper technologies while balancing foresight with practical implementation.” In the 448G/224G copper interconnect solution area, the live demonstration of the 448G KOOLIO™ CPC to OSFP Airchannel™ end-to-end solution took center stage. This solution fully replicates the end-to-end connection from KOOLIO™ CPC to panel I/O, supports bandwidth exceeding 90 GHz, and is compatible with multiple 448G signal transmission modes. With excellent measured performance, it not only validates the suitability of copper cables in high-bandwidth scenarios but also complements XPO optical interconnect solutions, fully demonstrating Luxshare-Tech’s technical prowess in optical-copper synergy.

448G KOOLIO™ CPC to OSFP Airchannel

Multi-Distance Coverage: Exhibition of Mid-to-Long-Range and Architecture Upgrade Interconnect Solutions

To address mid-to-long-range interconnect needs within and between data center racks, Luxshare-Tech showcased two high-speed interconnect solutions: the 1.6T OSFP AEC and the 1.6T OSFP ACC, which strike a balance between transmission distance and operational stability. The 1.6T OSFP AEC maintains stable operation over transmission distances of 4 meters with 27 AWG cable and 3 meters with 30 AWG cable, offering flexible adaptation to the cabling layouts of AI data centers of various scales. The 1.6T OSFP ACC, meanwhile, balances power consumption with transmission distance while prioritizing the reliability of cable assembly routing and installation. Even under harsh conditions such as complex cabling or twisting and bending, it maintains stable signal integrity, keeping bit error rate (BER) fluctuations within a minimal range. By balancing installation flexibility with transmission stability, it provides an efficient solution for cabling deployment in high-density data centers.

1.6T ACC & AEC/ACC

In addition, Luxshare-Tech showcased its new OSFP-XD PCIe 6.0 AEC products, providing core support for the upgrade of decoupled computing architectures in data centers. This product utilizes a high-density OSFP-XD package, specifically designed to extend the copper transmission distance for PCIe and CXL signals. Equipped with a Marvell® Alaska® P PCIe 6.0 retimer, it achieves a transmission distance of up to 7 meters, supports the PCIe 6 x16 specification, and delivers a total maximum bandwidth of 256G. It seamlessly integrates with evolutionary decoupled computing architectures such as JBOG, JBOM, and JBOX, flexibly meeting inter-rack and intra-rack connectivity needs, and helping data centers achieve architectural upgrades and performance enhancements.

OSFP-XD PCIE 6.0 AEC

Full-Stack Portfolio: A Comprehensive One-Stop Interconnect Solution Ecosystem

At OFC, Luxshare-Tech not only presented live demonstrations of core interconnect products such as XPO and 224G/448G but also showcased a full range of supporting products, including high-speed connectors, optical modules, thermal management, and power management systems, establishing a “one-stop” interconnect solution ecosystem. From the forward-looking deployment of XPO ultra-high-density optical interconnects to the mature implementation of 224G/448G copper interconnects, and further to full-stack support for thermal and power management, Luxshare-Tech leverages its vertical integration capabilities across three key areas—electrical interconnects, optical interconnects, and liquid cooling systems—to comprehensively support the overall needs of high-end AI-driven data centers. This helps customers streamline their supply chain layouts, enhance deployment efficiency, and achieve full-scenario coverage from core interconnect components to the entire rack infrastructure.

Luxshare-Tech Booth Product Display

Deep Technical Expertise: Empowering AI Data Center Upgrades Through Vertical Integration

As a global provider of core data center component solutions, Luxshare-Tech has always adhered to the core philosophy of “Deepening Technology, Connecting the Future.” With technological innovation at its core, Luxshare-Tech has dedicated itself to the high-speed interconnect sector, actively participating in the formulation of next-generation interconnect standards while continuously driving the commercialization and performance optimization of current-generation interconnect technologies. The technology showcase at OFC, centered on the XPO comprehensive solution, marks a significant milestone for Luxshare-Tech in the ultra-high-density optical interconnect sector and serves as a firm commitment to advancing global AI data center interconnect technology.

Moving forward, Luxshare-Tech will continue to leverage its deep expertise and global influence in electrical interconnects, optical interconnects, and liquid cooling systems. The company will persist in advancing technical research and development and exploring advanced materials science, continuously refining its product portfolio of high-speed optical and copper interconnects—represented by XPO—while actively participating in the standardization and industrialization of global interconnect technologies. Luxshare-Tech is committed to providing robust support for the upgrade of global computing infrastructure and working together with industry partners to build a new ecosystem for AI data center optical interconnects.