​Luxshare-Tech Showcases at DesignCon 2026, Unveiling 224G/448G Interconnect Innovations

As the core bottleneck in the AI data center ecosystem shifts from computing power to interconnect transmission. High-speed, reliable, and scalable interconnect technologies have become the cornerstone for advancing next-gen AI and HPC applications.

From February 24-26, 2026, DesignCon 2026 was held at the Santa Clara Convention Center. As a global provider of core component data center solutions, Luxshare-Tech showcased its latest technological achievements, highlighting innovative 224G and 448G interconnect products. Through comprehensive end-to-end solutions, Luxshare-Tech precisely addresses the interconnect demands of data centers in the AI era.

This year's event buzzed with excitement about accelerating toward 448G and PCIe 8.0. While 224G is currently entering the deployment phase, attention has already shifted to the next frontier of speed. Major pathfinding demonstrations offered early electrical performance previews of PCIe 8.0 and its 256 GT/s signaling, alongside 448 Gbps differential interconnects that are pushing boundaries toward sub-terabit-per-lane bandwidth. This progression represents more than a simple increase in data rate; it signals a fundamental transformation in how data moves across next-generation systems.

Against this backdrop, Luxshare-Tech’s innovations are designed not only to meet today’s 224G deployment requirements, but also to align with the architectural shifts demanded by 448G and beyond. As signaling speeds reach extreme frequencies, the industry is increasingly moving toward co-packaged and near-ASIC connectivity to overcome the physical limitations imposed by signal loss. By bringing copper and optical components closer to the ASIC, new architectures enable ultra-short-reach, high-density links that effectively bypass the constraints of traditional PCBs.

Co-packaged copper platforms and next-generation CPC architectures are no longer merely experimental concepts; they are rapidly becoming foundational pillars of tomorrow’s AI fabrics and data center infrastructures. It was a privilege to share our insights during DesignCon and demonstrate how Luxshare-Tech’s latest innovations are actively supporting this next era of high-speed connectivity.

Core Breakthroughs: Live Demos Unlock High-Speed Interconnect Possibilities

At the booth, Luxshare-Tech blended live demonstrations with a robust product technology portfolio showcase:

1. 224G/448G Copper Interconnect Solutions: Stable, Efficient, and Practical Application Scenarios

The featured live demonstration of the 448G KOOLIO™ CPC to OSFP Airchannel™ end-to-end solution fully replicates the entire link from KOOLIO™ CPC to panel I/O. By simulating real-world scenarios with external interconnect cables, it not only supports bandwidth exceeding 90GHz but also accommodates multiple 448G signal transmission modes. Its outstanding practical performance validates the continued applicability of copper cables in 448G scenarios.

The complementary 224G KOOLIO™ CPC-to-CPC Cable solution delivered outstanding performance, maintaining excellent signal integrity under complex cabling conditions and in optimal bend-radius scenarios. It reliably achieved 224G transmission rates while minimizing torsion-related impact on cable assemblies and dual-axis cables. Balancing reliability and practicality, it adapts to diverse data center cabling requirements.

2. 1.6T OSFP AEC/ACC Copper Cables: Balancing Transmission Distance and Operational Stability

Beyond its 224G/448G core products, Luxshare-Tech simultaneously showcased two solutions-1.6T OSFP AEC and 1.6T ACC, effectively covering medium-to-long-distance interconnect scenarios within and between cabinets:

·      1.6T OSFP AEC: Maintains stable operation over 4 meters with 27AWG and 3 meters with 30AWG cables, flexibly adapting to cabling requirements across data centers of varying scales.

·      1.6T ACC: Balances power consumption and transmission length while prioritizing cable assembly reliability for routing and installation. Maintains stable signal integrity under complex cabling and severe conditions like twisting/bending, with bit error rate (BER) fluctuations controlled within minimal ranges-combining installation flexibility with transmission stability.

3. OSFP-XD PCIe 6.0 AEC: Enabling Decoupled Computing Architecture Upgrades

The newly showcased OSFP-XD PCIe 6.0 AEC product at this exhibition offers significant technical advantages. Utilizing a high-density OSFP-XD package, it is specifically designed to extend copper transmission distances for PCIe and CXL signals. When paired with the Marvell Alaska® P PCIe 6.0 retimer, it achieves a transmission distance of up to 7 meters, supports PCIe 6 x16 specifications, and delivers a maximum total bandwidth of 256GB/s. It seamlessly integrates with evolving decoupled computing architectures such as JBOG, JBOM, and JBOX, flexibly addressing inter and intra-rack connectivity needs to power data center architecture upgrades.

4. Total AI Rack Solutions

Beyond live demonstrations of core interconnect products, Luxshare-Tech showcased a comprehensive suite of complementary solutions, including high-speed connectors, optical modules, thermal and power management systems. This fully supports the end-to-end requirements of high-end AI-driven data centers, establishing a “one-stop” interconnect solution ecosystem that helps customers streamline supply chain layouts and enhance deployment efficiency.

Technical Insights: In-Depth Analysis of High-Speed Interconnect Core Technologies and Development Trends

During the technical session, Luxshare-Tech's expert team presented to 200+ attendees: “Enabling 224G/448G Co-Packaged Copper Architectures” detailing how Luxshare-Tech's Co-Packaged Copper (CPC) solution overcomes technical challenges through advanced design as transmission speeds increase to 224G and 448G and signal pair density grows; Under the title “Top Side Interconnect Enabling for PCIe 7.0 and Beyond,” Luxshare-Tech shared core technical pathways focused on optimizing signal integrity in interconnect components to support 128Gbps and higher-speed PCIe transmission, providing cutting-edge technical references for industry peers.

Innovation Never Stops, Luxshare-Tech Powers Next-Generation Interconnect Upgrades

The rapid advancement of AI and HPC industries is driving continuous iterations in data center interconnect technology requirements. Luxshare-Tech remains committed to technological innovation, leading advancements in rack-level architecture interconnects. Through extensive ecosystem collaboration, we continuously optimize data throughput, energy efficiency, and operational reliability, pushing the boundaries of high-speed interconnect technology.

Participating in DesignCon 2026 serves as both a showcase of Luxshare-Tech's interconnect innovation capabilities and a firm commitment to advancing global AI data center upgrades. Moving forward, Luxshare-Tech will deepen its focus on pre-research and advanced materials science, continuously refine its product portfolio, and collaborate with customers and partners to build an interconnect ecosystem tailored for next-generation architectures.