DesignCon 2026 Preview - Luxshare-Tech is Enabling Next-Gen 224G and 448G Interconnects

Join Luxshare-Tech at DesignCon, booth #839, where we will be showcasing our latest products and solutions. 

Building on our commitment to innovation, we've prepared a series of live demonstrations and product showcases focused on high-speed interconnects and advanced connectivity solutions that address the escalating demands of AI, HPC and next-gen data center architecture.

Live Demos featured on the Luxshare-Tech Booth

• 448G KOOLIO™ CPC to OSFP Airchannel™ 

• 1.6T AEC

• 1.6T ACC

• 224G+ KOOLIO™ CPC to NEXUS™ Backplane Cable

• OSFP-XD PCIe 6 AEC

In addition to live demos, an array of products and technologies will be showcased on the Luxshare-Tech booth, including but not limited to: 

• High-Speed Interconnects

• Optical Transceivers

• Thermal Management

• Power Interconnects and Management

Learn More from Our Experts!

Beyond our booth, our expert-led sessions will provide deeper insights into the technologies shaping next-generation high-speed architectures.

1. Enabling 224G/448G Co-Packaged Copper Architectures

·      Tuesday, February 24 | 2:00 PM - 4:30 PM

·      Presented by Luxshare-Tech

2. Top Side Interconnect Enabling for PCIe 7.0 and Beyond

·      Wednesday, February 25 | 3:00 PM - 3:45 PM

·      Co-presented by Luxshare-Tech

Whether you’re exploring new architectures or preparing for the next leap in data rate demands, we look forward to connecting with you during DesignCon. 

If you are interested in meeting with a team member at DesignCon, be sure to Contact us to schedule a meeting.